Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17110122
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Filing Dt:
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12/02/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Inventors:
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Cheng-Fei Yu, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai, Chang-Chen TSAO
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Title:
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FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| DUANE MORRIS LLP (TSMC) IP DEPARTMENT |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103-4196 |
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