Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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16776279
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Filing Dt:
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01/29/2020
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Publication #:
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Pub Dt:
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07/30/2020
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Inventors:
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Khandker Nazrul Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti et al
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Title:
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DEVICE WITH EMBEDDED HIGH-BANDWIDTH, HIGH-CAPACITY MEMORY USING WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 46831 LAKEVIEW BLVD. |
| FREMONT, CALIFORNIA 94538 |
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| VLP LAW GROUP LLP |
| 555 BRYANT STREET SUITE 820 |
| PALO ALTO, CA 94301 |
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