Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17025966
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Filing Dt:
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09/18/2020
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Inventors:
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Jay C. Maghirang, Ng Chin Chuan, Howell John Chua Toc, Ariel B. Hontiveros
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Title:
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Camera Module Subcomponents Attached Via Vertically-Spread Adhesive
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE APPLE PARK WAY |
| CUPERTINO, CALIFORNIA 95014 |
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| ROBERT C. KOWERT |
| 1120 S CAPITAL OF TEXAS HWY BUILDING 2, SUITE 300 |
| AUSTIN, TX 78746 |
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06/18/2024 05:38 PM
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