Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
06/13/2023
|
Application #:
|
16366064
|
Filing Dt:
|
03/27/2019
|
Publication #:
|
|
Pub Dt:
|
10/17/2019
| | | | |
Inventors:
|
Douglas P. Riemer, Peter F. Ladwig
|
Title:
|
Plating Method To Reduce Or Eliminate Voids In Solder Applied Without Flux
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
40 WEST HIGHLAND PARK DRIVE NE |
HUTCHINSON, MINNESOTA 55350 |
|
|
|
MARIA S. SWIATEK |
P.O. BOX 26769 |
SAN FRANCISCO, CA 94126 |
|
|
Search Results as of:
06/25/2024 01:00 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|