Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17319687
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Filing Dt:
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05/13/2021
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Publication #:
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Pub Dt:
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08/26/2021
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Inventors:
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Feng Wei KUO, Chin-Yuan HUANG, Ho-Hsiang CHEN, Shuo-Mao CHEN, Kai-Yun LIN, Chewn-Pu JOU
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Title:
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INTEGRATED CIRCUIT STACK VERIFICATION METHOD AND SYSTEM FOR PERFORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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