Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17198332
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Filing Dt:
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03/11/2021
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Publication #:
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Pub Dt:
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01/20/2022
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Inventor:
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Bongken YU
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Title:
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SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| F. CHAU & ASSOCIATES, LLC |
| 130 WOODBURY ROAD |
| WOODBURY, NY 11797 |
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