Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2023
|
Application #:
|
17169499
|
Filing Dt:
|
02/07/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/27/2021
| | | | |
|
Inventors:
|
Yao-Wen HSU, Ching-Hung KAO, Po-Jen WANG, Tsung-Han TSAI
|
|
Title:
|
SEMICONDUCTOR WAFER WITH MODIFIED SURFACE AND FABRICATION METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| R. BURNS ISRAELSEN |
| MASCHOFF BRENNAN |
| 1389 CENTER DR., SUITE 300 |
| PARK CITY, UT 84098 |
|
|
Search Results as of:
11/10/2024 12:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
