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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2023
Application #:
17245537
Filing Dt:
04/30/2021
Publication #:
Pub Dt:
11/03/2022
Inventors:
Shih-Yao Lin, Hsiao Wen Lee, Chih-Han Lin
Title:
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Assignment: 1
Reel/Frame:
056185/0477Recorded: 05/10/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/03/2021
Exec Dt:
05/09/2021
Exec Dt:
05/06/2021
Assignee:
8, LI-HSIN 6 ROAD
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
FOLEY & LARDNER LLP
500 WOODWARD AVENUE
SUITE 2700
DETROIT, MI 48226

Search Results as of: 11/12/2024 01:48 PM
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