Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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17079587
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Filing Dt:
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10/26/2020
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Publication #:
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Pub Dt:
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05/06/2021
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Inventors:
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Ralf Otremba, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff et al
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Title:
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Semiconductor Package and Method for Fabricating a Semiconductor Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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