Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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17167273
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Filing Dt:
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02/04/2021
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Publication #:
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Pub Dt:
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06/03/2021
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Inventors:
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Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou, Feng Wei Kuo, Wen-Shiang Liao
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Title:
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Integrated Fan-Out Package with 3D Magnetic Core Inductor
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| JONES DAY |
| 250 VESEY STREET |
| NEW YORK, NY 10281-1047 |
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