Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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17286519
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Filing Dt:
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04/19/2021
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Publication #:
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Pub Dt:
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11/18/2021
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Inventors:
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Sungchul PARK, Chulwoo PARK, Sangwon HA
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Title:
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SUBSTRATE CONNECTION MEMBER COMPRISING SUBSTRATE HAVING OPENING PART, WHICH ENCOMPASSES REGION IN WHICH THROUGH WIRE IS FORMED, AND CONDUCTIVE MEMBER FORMED ON SIDE SURFACE OF OPENING PART, AND ELECTRONIC DEVICE COMPRISING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| CHA & REITER, LLC |
| 17 ARCADIAN AVENUE |
| SUITE 208 |
| PARAMUS, NJ 07652 |
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