Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17444233
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Filing Dt:
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08/02/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Inventors:
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KUO-WEI TSENG, PO-CHI CHEN
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Title:
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TEST PAD STRUCTURE OF CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11F-1, NO. 5, TAIYUAN 1ST ST. |
JHUBEI CITY, HSINCHU COUNTY, TAIWAN 302 |
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ROSENBERG, KLEIN & LEE |
3458 ELLICOTT CENTER DRIVE, SUITE 101 |
ELLICOTT CITY, MD 21043 |
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09/25/2024 12:53 PM
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