Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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16686452
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Filing Dt:
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11/18/2019
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Publication #:
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Pub Dt:
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11/19/2020
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Inventors:
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Yunxiang DI, Mengbin LIU, Situo XU
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Title:
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AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 309, AREA C, F3, BUILDING 1, NO.95, LANE 85, CAILUN ROAD, PILOT FREE TRADE ZONE |
| SHANGHAI, CHINA 201210 |
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| ANOVA LAW GROUP C/O SMIC |
| 21495 RIDGETOP CIRCLE |
| SUITE 300 |
| STERLING, VA 20166 |
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