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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/04/2023
Application #:
17665556
Filing Dt:
02/06/2022
Publication #:
Pub Dt:
05/26/2022
Inventor:
Shuzo AKEJIMA
Title:
EMBEDDED MODULE
Assignment: 1
Reel/Frame:
058936/0029Recorded: 02/09/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/11/2020
Assignee:
4-20-2-1009 MUTSUURA-MINAMI
KANAZAWA-KU
YOKOHAMA-SHI, JAPAN 2360038
Correspondent:
FRANKLIN & ASSOCIATES INTERNATIONAL INC
228 HAMILTON AVE, 3RD FLOOR
PALO ALTO, CA 94301

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