Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17674957
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Filing Dt:
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02/18/2022
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Inventors:
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Ying-Hua CHEN, Hau-Yan LU, Wen-Chen LU
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Title:
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PHOTONIC PACKAGE DEVICE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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BIRCH STEWART KOLASCH & BIRCH LLP |
8110 GATEHOUSE ROAD, SUITE 100 EAST |
FALLS CHURCH, VA 22042 |
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05/30/2024 10:42 AM
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