Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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16917492
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Filing Dt:
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06/30/2020
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Inventors:
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Roberto Marcoccia, Benjamin M. Curtin
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Title:
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DIE-TO-WAFER BONDING UTILIZING MICRO-TRANSFER PRINTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1133 INNOVATION WAY |
| SUNNYVALE, CALIFORNIA 94089 |
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| SCHWEGMAN LUNDBERG & WOESSNER / JUNIPER |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1133 INNOVATION WAY |
| SUNNYVALE, CALIFORNIA 94089 |
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| SCHWEGMAN LUNDBERG & WOESSNER P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6868 CORTONA DRIVE |
| SUITE C |
| GOLETA, CALIFORNIA 93117 |
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| SCHWEGMAN LUNDBERG & WOESSNER |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6868 CORTONA DRIVE |
| SUITE C |
| GOLETA, CALIFORNIA 93117 |
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| SCHWEGMAN LUNDBERG & WOESSNER |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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09/26/2024 08:29 AM
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