Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/25/2023
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Application #:
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17472821
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Filing Dt:
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09/13/2021
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Inventors:
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Daniel Yohannes, Denis Amparo, Oleg Mukhanov, Andrei Talalaevskii, John Vivalda et al
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Title:
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SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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150 CLEARBROOK ROAD, 150 |
ELMSFORD, NEW YORK 10523 |
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STEVEN M HOFFBERG |
29 BUCKOUT ROAD |
HOFFBERG & ASSOCIATES |
WEST HARRISON, NY 10604 |
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