Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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17750201
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Filing Dt:
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05/20/2022
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Publication #:
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Pub Dt:
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09/08/2022
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Inventors:
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Mahantesh HANCHINAL, Chi Wei HU, Shu-Yi YING, Min-Yuan TSAI
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Title:
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METHOD AND LAYOUT OF AN INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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HAUPTMAN HAM, LLP (TSMC) |
2318 MILL ROAD |
SUITE 1400 |
ALEXANDRIA, VA 22314 |
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05/30/2024 11:47 AM
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