Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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17378356
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Filing Dt:
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07/16/2021
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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JEN-FU LIU, MING HUNG TSENG, YEN-LIANG LIN, LI-KO YEH, HUI-CHUN CHIANG, CHENG-CHIEH WU
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Title:
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METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 1100 QUAIL STREET, SUITE 202 |
| NEWPORT BEACH, CA 92660 |
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