Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17750118
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Filing Dt:
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05/20/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Yan Xun Xue, Long-Ching Wang, Madhur Bobde, Bo Chen
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Title:
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WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 KING STREET WEST, SUITE # 6000 |
| TORONTO, CANADA ONTARIO M5X 1E2 |
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| CHEN-CHI LIN |
| 1119 QUAIL CREEK CIRCLE |
| SAN JOSE, CA 95120 |
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