Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17012817
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Filing Dt:
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09/04/2020
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Chin Hui Chong, Hong Wan Ng, Kelvin Tan Aik Boo, Seng Kim Ye, Hem P. Takiar
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Title:
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SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 FEDERAL WAY |
BOISE, IDAHO 83716-9632 |
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LOWENSTEIN SANDLER LLP / MICRON PATENT D |
ONE LOWENSTEIN DRIVE |
ROSELAND, NJ 07068 |
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05/25/2024 01:33 PM
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