Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17552864
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Filing Dt:
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12/16/2021
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Publication #:
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Pub Dt:
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10/06/2022
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Inventors:
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Seungbae SON, Gibag YI
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Title:
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MODULE ASSEMBLY AND MULTI-MASTER COMMUNICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1307-HO, 1308-HO 311 GANGNAM-DAERO SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06628 |
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| DINSMORE & SHOHL LLP |
| 255 EAST FIFTH STREET, SUITE 1900 |
| CINCINNATI, OH 45202 |
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