Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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17496889
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Filing Dt:
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10/08/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Inventors:
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Tsang-I TSAI, Yi-Shen LIN, Min-Wei HSU, Chen-Xi YU
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Title:
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Systems And Methods Of Applying Materials To Components
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| C3 & C4, HONG TAI INDUSTRY PARK |
| NO. 87 TAIFENG ROAD, TEDA |
| TIANJIN, CHINA 300457 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| 7700 BONHOMME, SUITE 400 |
| ST. LOUIS, MO 63105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16401 SWINGLEY RIDGE ROAD, SUITE 700 |
| CHESTERFIELD, MISSOURI 63017 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| 7700 BONHOMME, SUITE 400 |
| ST. LOUIS, MO 63105 |
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