Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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17106211
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Filing Dt:
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11/30/2020
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Publication #:
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Pub Dt:
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07/01/2021
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Inventors:
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CHUN-CHI HSU, CHUN-TING LAI, CHIH-WEI LIN
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Title:
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COMPOSITE FILM FOR USE IN LED WAFER-LEVEL PACKAGING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.127, SEC.3, WENDER RD., SHINPU JEN |
| HSINCHU HSIEN, TAIWAN 305 |
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| GIANT GROUP CORPORATION |
| 8102 POSTOAK ROAD |
| POTOMAC, MD 20854 |
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