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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/2023
Application #:
17213767
Filing Dt:
03/26/2021
Publication #:
Pub Dt:
01/20/2022
Inventors:
Kwangwuk PARK, Sungdong CHO, Hyoungyol MUN, Youngmin LEE, Eunji KIM, Seokhwan JEONG
Title:
THROUGH VIA ELECTRODE AND DEVICE ISOLATION STRUCTURE INCLUDING OXIDE LAYER PATTERN AND NITRIDE LAYER PATTERN SEQUENTIALLY STACKED ON INNER SURFACE OF TRENCH
Assignment: 1
Reel/Frame:
055754/0146Recorded: 03/29/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/22/2021
Exec Dt:
02/22/2021
Exec Dt:
03/04/2021
Exec Dt:
03/04/2021
Exec Dt:
02/25/2021
Exec Dt:
02/22/2021
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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