Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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17200705
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Filing Dt:
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03/12/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Chenguang YIN, Yenheng Chen
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Title:
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WAFER-LEVEL CHIP SCALE PACKAGING STRUCTURE HAVING A REWIRING LAYER AND METHOD FOR MANUFACTURING THE WAFER-LEVEL CHIP SCALE PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 78 CHANGSHAN AVENUE |
| JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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| ALSTON & BIRD LLP |
| BANK OF AMERICA PLAZA |
| 101 SOUTH TRYON STREET, SUITE 4000 |
| CHARLOTTE, NC 28280-4000 |
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