Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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17832670
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Filing Dt:
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06/05/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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Ian CRAYFORD, Shin-Hao CHIEN, Kuan-Hsiung WEI
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Title:
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MODULAR PHYSICAL LAYER AND INTEGRATED CONNECTOR MODULE FOR LOCAL AREA NETWORKS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F, NO. 172, CHENG TEH ROAD |
TAIPEI, TAIWAN 11167 |
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PETER SU |
3000 EL CAMINO REAL, BLDG 4 - SUITE 200 |
PALO ALTO, CA 94306 |
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06/19/2024 07:01 AM
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