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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11740559
Issue Dt:
08/29/2023
Application #:
17498437
Filing Dt:
10/11/2021
Publication #:
20220028685
Pub Dt:
01/27/2022
Inventors:
Brian J. Cardineau, Alan J. Telecky, Benjamin L. Clark, Mollie Waller, Kai Jiang et al
Title:
APPARATUSES FOR REDUCING METAL RESIDUE IN EDGE BEAD REGION FROM METAL-CONTAINING RESISTS
Assignment: 1
Reel/Frame:
057764/0112Recorded: 10/12/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WALLER, MOLLIE
Exec Dt:
10/06/2017
CARDINEAU, BRIAN J.
Exec Dt:
10/06/2017
JIANG, KAI
Exec Dt:
10/06/2017
TELECKY, ALAN J.
Exec Dt:
10/06/2017
MEYERS, STEPHEN T.
Exec Dt:
10/06/2017
CLARK, BENJAMIN L.
Exec Dt:
10/06/2017
Assignee:
INPRIA CORPORATION
1100 NE CIRCLE BOULEVARD
SUITE 360
CORVALLIS, OREGON 97330
Correspondent:
DIANE E. BENNETT, PH.D.
CHRISTENSEN, FONDER, DARDI & HERBERT PLLC
11322 86TH AVENUE NORTH
MAPLE GROVE, MN 55369
Assignment: 2
Reel/Frame:
064439/0580Recorded: 07/31/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INPRIA CORPORATION
Exec Dt:
03/01/2023
Assignee:
TOKYO ELECTRON LIMITED
AKASASKA BIZ TOWER
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
PETER S. DARDI, PH.D.
11322 86TH AVENUE NORTH
MAPLE GROVE, MN 55369

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