Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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16954250
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Filing Dt:
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06/16/2020
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Publication #:
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Pub Dt:
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11/25/2021
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Inventors:
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Ravindra Kumar Akarapu, Priyank Paras Jain, Amit Halder, Weidong Li
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Title:
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MULTI-WALL THICKNESS, THIN-WALLED HONEYCOMB BODIES, AND EXTRUSION DIES AND METHODS THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SP-TI-3-1 |
| CORNING, NEW YORK 14831 |
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| CORNING INCORPORATED |
| SP-TI-3-1 |
| CORNING, NY 14831 |
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