Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17711067
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Filing Dt:
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04/01/2022
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Publication #:
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Pub Dt:
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07/14/2022
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Inventors:
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Chaung-Lin LAI, Tsang-Yu LIU, Shu-Ming CHANG
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Title:
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CHIP PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD. |
ZHONGLI DIST. |
TAOYUAN CITY, TAIWAN 320 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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09/23/2024 06:48 AM
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