Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17095151
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Filing Dt:
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11/11/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Inventors:
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Jui-Cheng Huang, Wen-Chuan Tai, Allen Timothy Chang, Yu-Jie Huang
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Title:
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Wafer-level Packaging of Solid-state Biosensor, Microfluidics, and Through-Silicon Via
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. |
| 6 HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MERCHANT & GOULD P.C. |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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