Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17676960
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Filing Dt:
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02/22/2022
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Publication #:
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Pub Dt:
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08/24/2023
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Inventors:
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Kun WU, Ziyang GAO, Danting XU
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Title:
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Power Converter Package with Thermally Enhanced Interposers to Cooling Fins
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5/F PHOTONICS BUILDING,2 SCIENCE PARK EAST AVENUE,HONG KONG SCIENCE PARK,SHATIN,NEW TERRITORIES |
| HONG KONG, CHINA |
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| STUART T AUVINEN |
| 429 26TH AVE. |
| SANTA CRUZ, CA 95062 |
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06/19/2024 07:27 PM
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