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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/12/2023
Application #:
17319102
Filing Dt:
05/13/2021
Inventors:
Hua-Kuei Lin, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu, Chewn-Pu Jou et al
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
056538/0919Recorded: 06/14/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/12/2021
Exec Dt:
05/26/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/28/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/15/2021
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN
Assignment: 2
Reel/Frame:
056555/0118Recorded: 06/16/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/12/2021
Exec Dt:
05/26/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/28/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/15/2021
Exec Dt:
05/12/2021
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondent:
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI, TAIWAN

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