Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17313217
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Filing Dt:
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05/06/2021
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee
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Title:
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INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| NZ CARR LAW OFFICE |
| 2101 CITYWEST BLVD. STE 100 |
| HOUSTON, TX 77042 |
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