Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17213162
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Filing Dt:
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03/25/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Hong-Wei Chan, Jiing-Feng Yang, Yung-Shih Cheng, Yao-Te Huang, Hui Lee
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTMENT PATTERN IN BONDING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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