Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17186726
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Filing Dt:
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02/26/2021
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Jiun Yi Wu, Chen-Hua Yu
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Title:
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SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP/TSMC |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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09/23/2024 03:59 AM
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