Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17740322
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Filing Dt:
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05/09/2022
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Publication #:
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Pub Dt:
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12/01/2022
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Inventors:
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Chiung C. Lo, Hsien-Ken Liao
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Title:
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SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 7,9, LN. 7, JIAFENG 10TH RD., ZHUBEI CITY |
| HSINCHU COUNTY, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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