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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/19/2023
Application #:
17246397
Filing Dt:
04/30/2021
Publication #:
Pub Dt:
11/04/2021
Inventors:
Lin Lee Cheong, Qing Zhu, Michael Keleher, Tomonori Honda, Richard Burch et al
Title:
Wafer Bin Map Based Root Cause Analysis
Assignment: 1
Reel/Frame:
063884/0091Recorded: 06/07/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/25/2023
Exec Dt:
05/26/2023
Exec Dt:
05/26/2023
Exec Dt:
05/26/2023
Exec Dt:
06/02/2023
Exec Dt:
06/02/2023
Assignee:
2858 DE LA CRUZ BLVD.
SANTA CLARA, CALIFORNIA 95050
Correspondent:
IGOR SHOIKET
ONE EMBARCADERO CENTER; SUITE 720
SAN FRANCISCO, CA 94111
Assignment: 2
Reel/Frame:
070893/0428Recorded: 04/21/2025Pages: 53
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/07/2025
Assignee:
P.O. BOX 760776
MAC T7422-012
SAN ANTONIO, TEXAS 78245
Correspondent:
BETTY G. SMITH, SENIOR PARALEGAL
MCGUIREWOODS LLP, 201 N. TRYON ST.
SUITE 3000
CHARLOTTE, NC 28202

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