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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11764187
Issue Dt:
09/19/2023
Application #:
16641241
Filing Dt:
02/23/2020
Publication #:
20200227388
Pub Dt:
07/16/2020
Inventors:
Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin et al
Title:
Semiconductor Packages, and Methods for Forming Semiconductor Packages
Assignment: 1
Reel/Frame:
052060/0913Recorded: 03/10/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WAIDHAS, BERND
Exec Dt:
02/18/2020
SEIDEMANN, GEORG
Exec Dt:
02/19/2020
WAGNER, THOMAS
Exec Dt:
02/12/2020
WOLTER, ANDREAS
Exec Dt:
02/12/2020
KOLLER, SONJA
Exec Dt:
02/13/2020
ORT, THOMAS
Exec Dt:
02/20/2020
AUGUSTIN, ANDREAS
Exec Dt:
02/21/2020
MAHNKOPF, REINHARD
Exec Dt:
02/17/2020
Assignee:
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
2SPL PATENT ATTORNEYS PARTG MBB
LANDAUBOGEN 3
MUNICH, 81373 GERMANY
Assignment: 2
Reel/Frame:
056524/0373Recorded: 06/08/2021Pages: 107
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTEL IP CORPORATION
Exec Dt:
05/12/2021
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ANGELA MILLER
C/O CPA GLOBAL
900 SECOND AVENUE SOUTH, SUITE 600
MINNEAPOLIS, MN 55402

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