Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
09/26/2023
|
Application #:
|
17181427
|
Filing Dt:
|
02/22/2021
|
Publication #:
|
|
Pub Dt:
|
06/10/2021
| | | | |
Inventors:
|
Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu et al
|
Title:
|
SEMICONDUCTOR STRUCTURE INCLUDING LOW-RESISTANCE INTERCONNECT AND INTEGRATED CIRCUIT DEVICE HAVING THE SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
|
|
|
HAYNES AND BOONE, LLP (24061) IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
|
|
Search Results as of:
09/22/2024 09:40 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|