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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/26/2023
Application #:
17397015
Filing Dt:
08/09/2021
Inventors:
Jayss Daniel Marshall, Biswajit Sur,  Mehrnoosh Vahidpour, Andrew Joseph Bestwick et al
Title:
Microwave Integrated Quantum Circuits with Cap Wafers and Their Methods of Manufacture
Assignment: 1
Reel/Frame:
057121/0245Recorded: 08/09/2021Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/30/2018
Exec Dt:
08/24/2018
Exec Dt:
10/30/2018
Exec Dt:
09/24/2019
Exec Dt:
01/21/2020
Exec Dt:
01/21/2020
Exec Dt:
01/21/2020
Exec Dt:
01/21/2020
Exec Dt:
10/29/2018
Assignee:
775 HEINZ AVE
BERKELEY, CALIFORNIA 94710
Correspondent:
HENRY PATENT LAW FIRM PLLC
ATTN: KE SUN
750 N. SAINT PAUL ST., SUITE 1660
DALLAS, TX 75201
Assignment: 2
Reel/Frame:
063308/0804Recorded: 04/12/2023Pages: 6
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/06/2021
Assignee:
775 HEINZ AVE
BERKELEY, CALIFORNIA 94710
Correspondent:
HENRY PATENT LAW FIRM PLLC
ATTN: KE SUN
8350 N. CENTRAL EXPY, SUITE 1750
DALLAS, TX 75206

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