Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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17822596
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Filing Dt:
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08/26/2022
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Publication #:
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Pub Dt:
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12/22/2022
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Inventors:
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Robert Edward Higashi, Son Thai Lu, Elenita Malasmas Chanhvongsak
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Title:
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THROUGH SILICON VIA FABRICATION
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Assignment:
1
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| 303 S TECHNOLOGY COURT |
| BROOMFIELD, COLORADO 80021 |
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| SCHWEGMAN LUNDBERG & WOESSNER, P.A. |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402-0938 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 855 S. MINT STREET |
| CHARLOTTE, NORTH CAROLINA 28202 |
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| SCHWEGMAN LUNDBERG & WOESSNER, P.A. |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402-0938 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 303 S TECHNOLOGY COURT |
| BROOMFIELD, COLORADO 80021 |
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| SCHWEGMAN LUNDBERG & WOESSNER, P.A. |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402-0938 |
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