Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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17712375
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Filing Dt:
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04/04/2022
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Publication #:
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Pub Dt:
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07/21/2022
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Inventors:
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Markus Dinkel, Eung San Cho, Ralf Otremba, Petteri Palm, Josef Hoeglauer, Fabian Schnoy
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 N. SEPULVEDA BLVD. |
| EL SEGUNDO, CALIFORNIA 90245 |
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| MURPHY, BILAK & HOMILLER, PLLC |
| PO BOX 1959 |
| CARY, NC 27572-1959 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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| MURPHY, BILAK & HOMILLER, PLLC |
| PO BOX 1959 |
| CARY, NC 27572-1959 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA A-9500 |
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| VANYA PEYCHEVA |
| AM CAMPEON 1-15 |
| PATENT DEPARTMENT MUC/11.2.348 |
| NEUBIBERG, 85579 GERMANY |
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