Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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17294985
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Filing Dt:
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05/18/2021
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Publication #:
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Pub Dt:
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07/07/2022
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Inventors:
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Yanfeng XU, Hua YAN, Jicong FAN, Yueer SHAN, Yanfei ZHANG
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Title:
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FPGA DEVICE FORMING NETWORK-ON-CHIP BY USING SILICON CONNECTION LAYER
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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FLOOR 2, BUILDING B1, NO. 777, WEST JIANZHU ROAD, BINHU DISTRICT |
WUXI, JIANGSU, CHINA 214000 |
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HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
45 SOUTH SEVENTH STREET |
SUITE 2700 |
MINNEAPOLIS, MN 55402 |
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09/22/2024 04:40 PM
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