Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17480178
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Filing Dt:
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09/21/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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Ryutaro Shimoishi, Isao Sugiyama, Daigo Ichikawa
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Title:
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SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI |
| NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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| RANKIN HILL AND CLARK LLP |
| 38210 GLENN AVENUE |
| WILLOUGHBY, OH 44094 |
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