Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17103524
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Filing Dt:
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11/24/2020
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Publication #:
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Pub Dt:
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05/27/2021
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Inventors:
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Samir Biswas, Ryan Joseph Grohsmeyer, Zakariya Radwan Khayat, Memduh Volkan Demirbas et al
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Title:
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MULTI-PIECE LAYERED HONEYCOMB EXTRUSION DIES AND METHODS OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SP-TI-3-1 |
| CORNING, NEW YORK 14831 |
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| CORNING INCORPORATED |
| SP-TI-3-1 |
| CORNING, NY 14831 |
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