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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/10/2023
Application #:
16404533
Filing Dt:
05/06/2019
Publication #:
Pub Dt:
08/22/2019
Inventors:
Manish Kumar SINGH, Bo-Wei CHOU, Jui-Ming SHIH, Wen-Yu KU, Ping-Jung HUANG, Pi-Chun YU
Title:
METHOD FOR ETCHING ETCH LAYER
Assignment: 1
Reel/Frame:
049116/0596Recorded: 05/08/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/27/2015
Exec Dt:
04/27/2015
Exec Dt:
04/27/2015
Exec Dt:
04/27/2015
Exec Dt:
04/27/2015
Exec Dt:
04/27/2015
Assignee:
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DR. SUITE 300
PARK CITY, UT 84098

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