Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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18182078
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Filing Dt:
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03/10/2023
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Inventors:
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Zaiyi LIAO, Hui FAN, Peihang YANG
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Title:
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CHIP-TO-MODULE CABLE ASSEMBLY AND PCB CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 19, JUYUANZHOU INDUSTRIAL PARK |
| NO. 618 JINSHAN RD., CANGSHAN DISTRICT |
| FUZHOU, FUJIAN, CHINA 350002 |
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| MICHAEL FAINBERG |
| 1301 AVENUE OF THE AMERICAS |
| ARENT FOX SCHIFF |
| NEW YORK, NY 10019 |
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