Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
10/17/2023
|
Application #:
|
17221479
|
Filing Dt:
|
04/02/2021
|
Inventors:
|
Sung Bok LEE, John SZCZECH, Josh WATSON
|
Title:
|
MEMS ASSEMBLY SUBSTRATES INCLUDING A BOND LAYER
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
1151 MAPLEWOOD DRIVE |
ITASCA, ILLINOIS 60143 |
|
|
|
FOLEY & LARDNER LLP |
3000 K STREET N.W. |
SUITE 600 |
WASHINGTON, DC 20007-5109 |
|
|
Search Results as of:
09/25/2024 05:48 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|