Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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16993867
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Filing Dt:
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08/14/2020
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Publication #:
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Pub Dt:
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02/18/2021
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Inventors:
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Pei Luan Pok, Roslie Saini bin Bakar, Chee Hong Lee, Yu Shien Leong, Yean Seng Ng et al
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Title:
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Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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MURPHY BILAK & HOMILLER/INFINEON TECHNO |
1255 CRESCENT GREEN |
CARY, NC 27518 |
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09/20/2024 04:07 AM
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